陳智

Effects of Pressure on the Microstructure and Bonding Quality of Low-Temperature Nanocrystalline Cu-Cu Bonding

前瞻半導體研究所

奈米晶銅、低溫銅-銅接合、熱壓接合、熱應力、(111)優選取向、跨介面晶粒生長、Nanocrystalline copper (NC-Cu)、Low-temperature Cu-Cu bonding、Thermo compression bonding (TCB)、Thermal stress、(111) preferred orientation、Cross-interface grain growth

Effects of Cu3Sn Passivation on the Reliability of Highly (111)-oriented Nanotwinned Copper Redistribution Lines

材料科學與工程學系

奈米雙晶銅、重布線層、鈍化處理、電遷移、介金屬化合物、Nanotwinned Cu、redistribution layer、passivation、electromigration、intermetallic compound

Electrical properties and interface porosity analysis of copper-copper joints structures at three bonding temperatures after HTS testing

工學院專班-半導體材料與製程設備學程

三維積體電路、銅對銅接合、熱壓接合、奈米雙晶銅、高溫儲存測試、3D IC、Cu joints、Cu–Cu bonding、nanotwinned Cu、High-temperature storage

Miniaturization and Geometric Morphology Control of Dam Process for SiP Modules

工學院專班-半導體材料與製程設備學程

系統級封裝、圍壩結構、非牛頓流體、螺桿閥、變異數分析、System-in-Package、Dam、Screw Valve、Rheology、ANOVA

Interfacial Microstructural Evolution and Shear Strength Analysis of Direct Bonding between Nanotwinned Copper and Nanocrystalline Copper

材料科學與工程學系

三維積體電路、銅銅直接接合、奈米雙晶銅、奈米細晶銅、微結構演化、3DIC、Cu–Cu direct bonding、Nanotwinned copper (NT-Cu)、Nanocrystalline copper (NC-Cu)、Microstructural evolution

Microstructural Engineering of Electrodeposited Copper Foils for Enhanced Mechanical Properties, Thermal Stability, and Functional Reliability

材料科學與工程學系

電鍍銅箔、奈米雙晶銅、細晶銅、銅鈀箔、微結構工程、機械穩定性、鋰離子電池、集電板、Electroplated Cu foil、Nanotwinned Cu、Fine-grained Cu、CuPd foil、Microstructure engineering、Mechanical stability、Lithium-ion battery、Current collector

Study of Thermal Stability and Grain Growth of nano-twinned Cu/SiO2 Hybrid Joints

工學院專班-半導體材料與製程設備學程

奈米雙晶銅、銅/二氧化矽異質接合、接合面穩定性、nano-twinned copper、Cu/SiO₂ hybrid bonding、interfacial stability

Cu-Cu Bonding Using Nanocrystalline Copper Lightly Doped with Nickel

材料科學與工程學系

銅銅接合、奈米細晶銅、奈米細晶銅鎳、先進封裝、自退火能力、Cu-Cu Bonding、Nanocrystalline Cu、Nanocrystalline Cu-Ni、Advanced Packaging、Self-Annealing

Investigation of Electromigration Behavior in Cu–Cu Joints under Different Bonding Interfaces

前瞻半導體研究所

三維積體電路、微凸塊、銅對銅接合、熱壓接合、奈米雙晶銅、異相性晶粒成長、電遷移、3D IC、Cu joints、Cu–Cu bonding、nanotwinned Cu、abnormal grain growth、electromigration

Impact of Cu Grain Size and Surface Orientation on the Low Temperature Cu-Cu Bonding

前瞻半導體研究所

奈米晶銅、奈米雙晶銅、表面(111)比例、低溫接合、介面孔洞、3D IC、Nanocrystalline Cu、Nanotwinned Cu、Surface (111) ratio、Low-temperature bonding、Interfacial voids

Impact of Cu Microstructure on Low Temperature Cu-Cu Micro-Via Bonding

材料科學與工程學系

三維積體電路異質整合、電鍍、細間距大馬士革製程、低溫銅銅接合、細晶粒銅、3D ICs heterogeneous integration、Electroplating、Fine-pitch damascene process、Low-temperature Cu-Cu bonding、Nanocrystalline Cu

Fabrication and Properties of Nanotwinned Copper Doped with Carbon Nanotubes by Rotary Electrodeposition

前瞻半導體研究所・共同指導：吳文偉

奈米雙晶銅、奈米碳管、旋轉電鍍、銅箔、機械性質、導電性質、熱穩定性、Nanotwinned Cu、Carbon Nanotubes、Rotary Electroplating、Copper Foil、Mechanical Properties、Electrical Properties、Thermal Stability

Optimizing Cu-Cu Bonding Quality in Nanotwinned Cu Films Through Plasma-Induced Surface Roughening

前瞻半導體研究所

先進封裝、奈米雙晶銅、銅銅接合、微結構、表面粗糙度、接合界面分析、Advanced packaging、surface roughness、Cu-Cu bonding、microstructure、bonding interface analysis、Nanotwinned Cu

Study of Electromigration Failures in Solder Microbumps with Cu/SnAg/Cu and Cu/SnAg/Ni Under-bump Metallizations

工學院專班-半導體材料與製程設備學程

電遷移、介金屬化合物、孔洞破壞、銲錫微凸塊、可靠度、Electromigration、intermetallic compound、void、solder microbumps、Reliability

Temperature Cycle Tests for Cu-SiO2 Hybrid Bonds

工學院專班-半導體材料與製程設備學程

銅-二氧化矽異質接合、溫度循環測試、熱壓接合的奈米雙晶銅、Cu-SiO2 Hybrid Bonds、Temperature Cycle Tests、Nano Twinning Cu-Cu bonding

Reliabilities and Fabrications of Cu-Cu Hybrid Joints for 3D IC Heterogeneous Integration

材料科學與工程學系

三維積體電路異質整合、銅-銅異質接點、細間距大馬士革製程、電遷移、可靠度、奈米雙晶銅、3D IC heterogeneous integration、Cu-Cu hybrid joint、fine-pitch damascene process、electromigration、reliability、nanotwinned Cu

Study of high-strength, high-conductivity, and high-thermal stability nanotwinned Cu-Ni foils using electroplating

材料科學與工程學系

電鍍銅箔、奈米雙晶銅箔、奈米雙晶銅鎳箔、複雜響應系統、超高抗拉強度、高熱穩定性、Electroplated Cu foil、NT-Cu foil、NT-Cu-Ni foil、Complex Response System、Ultra-high tensile strength、High thermal stability

Process Design of Hybrid Bonding for 3D IC Packaging Using In-Situ Heating AFM

材料科學與工程學系

三維積體電路封裝、異質接合、臨場原子力顯微鏡、熱膨脹量、奈米雙晶銅、奈米細晶銅、3D IC packaging、hybrid bonding、in-situ AFM、thermal expansion、nanotwinned Cu、nanocrystalline Cu

Surface Modification of Nanotwinned Copper and SiCN Using Plasma Activation for 3D IC Integration

前瞻半導體研究所

奈米雙晶銅、矽碳氮、電漿、室溫接合、接合強度、3D IC Integration、Nanotwinned Cu、SiCN、Plasma Treatment、Room Temperature Bonding、Bonding Strength

Strengthening Methods of Rotary-Electroplated Nanotwinned Copper Foils and Approaches to Resolve the Strength-Ductility (Electrical Conductivity) Trade-Off

材料科學與工程學系

旋轉電鍍法、奈米雙晶銅、機械性質、銅離子濃度、鈷離子、異質微觀結構、Rotary electrodeposition、Nanotwinned copper、mechanical properties、Concentration of Cu ions、Co ions、Heterogeneous microstructure

Study on Cu/SiO2 Hybrid Bonding Using Wet Hydrophilicity Enhancement for Chip-to-wafer Bonding

前瞻半導體研究所

三圍積體電路、晶片對晶圓接合、銅/二氧化矽異質接合、表面改質、低溫接合、界面分析、3D IC Integration、Chip-to-wafer Bonding、Cu/SiO2 Hybrid Bonding、Surface Treatment、Low-temperature Bonding、Interfacial Analysis

Comparison of Polyimide/Nanotwinned Cu and SiCN/Nanotwinned Cu Hybrid Bonding with Low-thermal-budget and High Bonding Quality

材料科學與工程學系

異質接合、接合機制、化學機械研磨、即時升溫原子力顯微鏡、聚醯亞胺、矽碳氮、奈米雙晶銅、Hybrid bonding、Bonding mechanism、Chemical-mechanical planarization、In-situ heating AFM、Polyimide、SiCN、Nanotwinned Cu

Fabrication and Characterization of Nanocrystalline and Nanotwinned Cu Foils by Rotary Electrodeposition

材料科學與工程學系

奈米雙晶銅、旋轉電鍍、銅箔、熱穩定性、導電性質、機械性質、微結構、Nanotwinned Cu、rotary electroplating、Copper foil、Thermal stability、Conductivity、Mechanical properties、Microstructures

Electromigration Lifetime Study on Nano Twinned Copper Redistribution Layer Wire By Different Polyimide Thickness

工學院專班-半導體材料與製程設備學程

奈米雙晶銅、重新分佈層、電遷移、聚醯亞胺厚度、先進封裝、Nano twinned Copper、Electromigration、RDL、Polyimide Thickness、Advanced Packaging

Intermediate-Temperature Mechanical Properties and Fracture Behavior of Copper Foils with Different Microstructures

材料科學與工程學系

電鍍銅箔、奈米雙晶銅、超細晶、中高溫機械性質、破裂行為、Electroplated copper foil、Nanotwinned copper、Ultrafine grain、Intermediate-temperature mechanical properties、Fracture behavior

Study of Nanoporous Cu and <111> oriented Nanotwinned Cu for Thermal Interface Materials in High-Power Device Packaging

材料科學與工程學系

熱界面材料、奈米孔洞銅、奈米雙晶銅、低溫接合、去合金法、Thermal interface material、Nanoporous Cu、Nanotwinned Cu、Low temperature bonding、Dealloying

Yield Rate Analysis and Improvement of Electronic Component in Reflow Process

工學院專班-半導體材料與製程設備學程

表面貼裝技術、回焊爐、覆晶封裝、焊接、熱壓鍵合、SMT、Reflow、Flip Chip、Soldering、TCB

Reliability of Low-Temperature Cu/SiO2 Hybrid Bonds Using {111}-Oriented Cu Surfaces

工學院專班-半導體材料與製程設備學程

Cu/SiO2 異質接合可靠度研究、{111}平面奈米雙晶銅、半導體封裝、金屬墊層、加速度溫濕度應力測試、奈米雙晶銅、Cu/SiO2 Hybrid Bonds、Reliability of Low-Temperature Cu/SiO2 Hybrid Bonds、semiconductor packaging、he acceleration temperature and humidity stress test、nano-twinned copper、Under Bump metallurgy

Fabrication and Reliability Study on Damascene Nanotwinned Copper Redistribution Layer

前瞻半導體研究所

奈米雙晶銅、重新佈層鑲嵌導線、微結構、晶粒成長、可靠度測試、Nanotwinned Cu、Redistribution layers、Microstructure、Grain growth、Reliability test

Study on Thermal Strain of Nanotwinned Cu Interconnects in Advanced Packaging by Using Synchrotron Radiation

材料科學與工程學系

奈米雙晶銅、重新佈層銅導線、異質接合、熱應變、同步輻射、機械性質、Nanotwinned Cu、RDLs、Hybrid bonding、Thermal Strain、Synchrotron Radiation、Mechanical properties

<111> Nanotwinned Cu Films for the Applications of Cu-Cu Bonding in Heat Pipes and Thermal Interface Materials of High Power Devices

材料科學與工程學系

奈米雙晶銅、微結構、散熱管、低溫接合、熱界面材料、Nanotwinned Cu、Microstructure、Heat pipe、Low temperature bonding、Thermal interface material

Study of Low Temperature Cu-Cu Direct Bonding and Cu/SiO2 Hybrid Bonding

材料科學與工程學系所

奈米雙晶銅、可靠度研究、銅-二氧化矽異質接合、精密界面分析、Highly <111>-oriented nanotwinned Cu (NT-Cu)、Bonding reliability enhancement、NT-Cu/SiO2 hybrid bonding、Interfacial analysis

Electroplating nickel-cobalt films with different content ratios as the reflow metal layer

工學院半導體材料與製程設備學程

電鍍鎳鈷、電鍍鎳、鎳鈷基合金、IC導線架、光學膜 (LIGA製程)、Electroplated nickel-cobalt、electroplated nickel、nickel-cobalt-based alloy、IC lead frame、optical film (LIGA process)

Effect Of Tin Crystal Orientation and Grain Size In Flip Chips To Electromigration

工學院半導體材料與製程設備學程

覆晶封裝、電遷移、Ni阻擋層、錫晶向、Cu-Sn 介金屬化合物、Flip-chip、Electromigration、Ni barrier layer、grain orientation、Cu-Sn IMC

Effect of Different Sn/Cu Powder Proportion and Sintering Time on Reliability of Transient Liquid Phase Sintering Structures

理學院應用科技學程

暫態液相燒結、TLPS、功率元件、介金屬化合物、IMC、溫度循環試驗、高溫儲存試驗、transient liquid phase sintering、power components、intermetallic compound、thermal cycling test、high-temperature storage test

Thermomigration of Intermetallic Compound in 30 µm Cu/SnAg/Cu solder micorbumps

電機學院電子與光電學程・共同指導：劉柏村

熱遷移、微結構、銲錫微凸塊、模擬熱遷移、thermomigration、microbumps、Copper

Failure Analysis of Reliability by Artificial Intelligence on The Instrument of 3D IC Packaging

材料科學與工程學系所・共同指導：鄒年棣

有限元素法、熱遷移、3D X-ray、卷積神經網路、AI、深度學習、Finite Element Method、Thermal Migration、Convolutional Neural Network、Deep Learning

Study of electromigration and stress migration in nano-twinned copper lines coated with titanium dioxide passivation layer

材料科學與工程學系所

奈米雙晶銅、重新佈層銅導線、電遷移、應力遷移、氧化、Nanotwinned Cu、RDLs、Electromigration、Stress migration、Oxidation

Tuning Microstructure of Nanotwinned Cu by Electroplating Waveforms for Low Temperature Cu-Cu Direct Bonding

材料科學與工程學系所

奈米雙晶銅、脈衝反向電流、熱穩定性、低溫、界面消除、異向各性晶粒生長、銅銅直接接合、nanotwinned Cu、pulse reverse current、low temperature bonding、Cu-Cu direct bonding

Effect of Surface Modification on Cu/SiO2 Hybrid Bonding

材料科學與工程學系奈米科技碩博士班

奈米雙晶銅、銅銅接合、介電材接合、微結構、表面改質、表面分析、Nanotwinned Cu、Copper- Copper bonding、Dielectric bonding、Surface analysis、Microstructure、Surface modification

Study on Evolution of Interfacial Voids in Cu Joints

材料科學與工程學系所

奈米雙晶銅、熱壓接合、界面孔洞、界面晶界、孔洞熟化、Nanotwinned Cu、Thermocompression Bonding、Interfacial Void、Interfacial grain boundary、Void Ripening

Failure Analysis of Electromigration of Ni/Sn/Ni Solder Microbumps under Low Temperature.

工學院半導體材料與製程設備學程

電遷移、介金屬化合物、孔洞生成、銲錫微凸塊、晶粒方向、可靠度、Electromigration、intermetallic compound、Void、Micro-bumps、Grain Orientation、Reliability

Growth of Intermetallic Compounds in Cu/SnAg/Cu、Cu/SnAg Solder Joint Under Various Temperature Gradients

材料科學與工程學系所

介金屬化合物、溫度梯度、熱遷移、覆晶接合、intermetallic compound、thermomigration、temperature gradient、flip chip technology

Instant Cu-Cu joints and their reliability issues

材料科學與工程學系所

三維積體電路封裝、銅－銅直接接合、快速銅－銅接合、低熱預算接合、表面潛變接合模型、溫度循環測試、電遷移、Three-dimensional integrated circuit、Cu-Cu direct bonding、Instant bonding、Low thermal budget bonding、Surface creep bonding model、Thermal cycling test、Electromigration

Studies of Electromigration Induced Void Damages in Ni/Sn/Ni Micro-Bumps by 3D X-ray Microscope

工學院半導體材料與製程設備學程

電遷移、孔洞缺陷、微結構、銲錫微凸塊、晶粒方向、Electromigration、Void、Microstructures、Micro-bumps、Grain Orientation

To Explore the Improvement of TiW Side Etching

工學院半導體材料與製程設備學程

蝕刻、凸塊、底切、蝕刻總量、掉凸塊、Etch、Bump、undercut、Etch amount、Missing bump

High Performance TaOx-Based Digital to Analog Switching Memristor for Wearable and Artificial Intelligence Applications

材料科學與工程學系所・共同指導：曾俊元

可撓式突觸、可穿戴憶阻器、人工神經網絡、環境穩健、人臉識別、Flexible synapse、wearable memristor、artificial neural networks、environmental robust、face recognition、Memristor

Effect of Sn grain size on the electromigration of Sn-Ag joints

工學院半導體材料與製程設備學程

覆晶、淬火、晶粒、電遷移、Flip-chip、Quench、Grain、Electromigration

Investigation of Thermal Stress and Grain Growth in Nanotwinned Copper during Annealing

材料科學與工程學系所

奈米雙晶銅、應力鬆弛、微結構、晶粒成長、電遷移、Nanotwinned Cu、Stress Relaxation、Microstructure、Grain Growth、Electromigration

Thermal Stress Analysis of Anisotropic Grain Growth and Electromigration Failure Mechanism of Nanotwinned Cu

材料科學與工程學系所

奈米雙晶銅、熱應力、重新佈層銅導線、電遷移、Nanotwinned Copper、Thermal Stress、RDLs、Electromigration、Oxidation

Effect of Tin Orientation in 30μm Microbumps on Early Failure of Electromigration

工學院半導體材料與製程設備學程

電遷移、銲錫晶粒之c軸與電子流夾角、Electromigration、The tin grain angle、Nickel UBM layer consumption

Study of Electromigration of Solder Microbumps by 3D X-ray Microscopy

工學院半導體材料與製程設備學程

電遷移、銲錫凸塊、Electromigration、Microbumps、3D X-ray

Research of high strength nanotwinned Cu foils fabricated by rotary plating

材料科學與工程學系所

奈米雙晶銅、鋰電池銅箔、機械性質、nanotwinned copper、copper foils for Li ion batteries、mechanical properties

Nano-carbide strengthened as-welded joint for precipitation-hardened austenitic Fe-Mn-Al-C lightweight alloys

材料科學與工程學系所・共同指導：劉增豐

鐵錳鋁碳合金、熔融焊接、κ-碳化物、旋節分解、機械性質、FeMnAlC alloy、Fusion welding、κ-carbide、Spinodal decomposition、Mechanical properties

Study on Chemcial-Mechanical Polishing of Package Composites

工學院半導體材料與製程設備學程

高分子、晶向銅、化學機械研磨、Polymer、Crystal-Oriented Copper、Chemical Mechanical Planarization

Electrodeposition and Microstructure Examination of the Radiating Columnar Nanotwinned Copper

工學院半導體材料與製程設備學程

奈米雙晶銅、<111>優選方向、柱狀晶、直流電鍍、Nanotwinned Copper、<111> -oriented、Columnar crystal、DC Electrodeposition

Hybrid Cu-Cu Bonding with Non-Conductive Paste and Highly (111)-Oriented Nanotwinned Copper

材料科學與工程學系所

奈米雙晶銅、異質接合、非導電膠、晶粒成長、後退火、Nanotwinned Cu、Hybrid Bonding、NCP、Grain Growth、Post-Annealing

The effect of thickness and microstructures on the mechanical properties of nanotwinned copper foils

材料科學與工程學系所

奈米雙晶銅、銅箔、機械性質、厚度、微結構、Nanotwinned Cu、Copper foil、Mechanical properties、Thickness、Microstructures

Study on Anisotropic Grain Growth and Electromigration of Electroplated (111)-oriented Nanotwinned Cu Films

材料科學與工程學系所

奈米雙晶銅、晶粒成長、優選方向、熱退火、電鍍、nanotwinned Cu、grain growth、preferred orientation、thermal annealing、electrodeposition

The Study of Etch Rate and Undercut by Cu Etchant

工學院半導體材料與製程設備學程

銅蝕刻液、蝕刻製程、雙氧水、磷酸、Copper etchant、Etching process、Hydrogen peroxide、Phosphoric acid

Study of microstructure control of nanotwinned copper and its thermal stability, electric and mechanical properties

材料科學與工程學系所

奈米雙晶銅、熱穩定性、機械性質、電阻率、微結構調控、nanotwinned copper、thermal stability、mechanical property、resistivity、microstructure control

Tuning residual stress in highly (111)-oriented nanotwinned Cu

材料科學與工程學系所・共同指導：古慶順

高(111)優選方向奈米雙晶銅膜、殘留應力、電鍍溫度、電鍍波形、residual stress、highly (111)-oriented nanotwinned Cu、bath temperatures、plating waveforms

Transformation of highly (111)-oriented nanotwinned Cu films to (200)- or (211)-oriented films at 400oC annealing using Ta and Co adhesion layers

工學院半導體材料與製程設備學程

奈米雙晶銅、鈷、鉭、退火、Nanotwinned copper、Cobalt、Tantalum、Annealing

Thermal Stability and Grain Growth of Electroplated Highly (111)-oriented Nanotwinned Cu Films

材料科學與工程學系所

奈米雙晶銅薄膜、(111)優選方向、氧化速率、異質晶粒成長、電鍍、nanotwinned Cu films、highly (111)-oriented、oxidation rate、electroplated、abnormal grain growth

Copper-to-copper direct bonding on highly (111) oriented and nano-twinned copper in no-vacuum ambient

材料科學與工程學系所

銅-銅直接接合、奈米雙晶銅、表面擴散接合、晶粒成長、機械力強度、電遷移、應力遷移、Cu-to-Cu direct bonding、nano-twinned Cu、fast surface diffusion character、surface creep、bonding interface、grain growth、grain orientation、shear strength、Electro-migration、and stress migration

Fabrication, characterization and application of highly (111)-oriented twinned gold film

材料科學與工程學系奈米科技碩博士班

金、直接接合、雙晶、晶粒成長、硬度、Gold、Direct Bonding、Twinned Structure、Grain growth、Hardness

Metallurgical Reactions of Various Thickness of Sn-Ag Solder with Ni and Cu Layer

工學院半導體材料與製程設備學程

微凸塊、錫銀銲錫、介金屬化合物、熱遷移效應、Microbump、SnAg solder、IMCs、Thermomigration

Electromigration Study of Ni/SnAg/Ni Flip-Chip Solder Joints

工學院半導體材料與製程設備學程

覆晶錫銀銲錫、電遷移、鬆餅狀孔洞、SnAg Flip-Chip Solder、Electromigratio、Pancake-type Voids

The Effect of Tin Grain Orientations and Grain Boundaries during Current Stressing on CuNiSn Intermetallic Compounds Formation

平面顯示技術碩士學位學程

覆晶銲錫、錫晶粒、電遷移、電阻、可靠度、介金屬化合物、Flip Chip、Tin grain、Electromigration、Resistance、Reliability、IMC

Study of interconnects in 3D IC packaging: microbump reliability and Cu-to-Cu direct bonding

材料科學與工程學系所

三維積體電路、微凸塊、熱循環、電遷移、銅直接接合、3D IC、microbump、thermal cycling、electromigration、Cu direct bonding

Effect of Seed Layers and Substrates on the Growth of Electroplated Nanotwinned-copper Films

材料科學與工程學系奈米科技碩博士班

晶種層、奈米雙晶銅、電鍍、高分子基板、Seed Layers、Substrates、Electroplating、Nanotwinned-copper

Study of Electrodeposition of Nanotwinned Cu Films at Different Bath Temperatures

材料科學與工程學系所

奈米雙晶銅、鍍液溫度、晶粒成長、電鍍、拉伸測試、nanotwinned Cu、electrodeposition、bath temperature、grain growth、tensile test

Study of Low Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films

材料科學與工程學系所

奈米雙晶銅、化學機械研磨、銅對銅直接接合、nanotwinned Cu、CMP、Cu-to-Cu direct bonding

A Study of Effect of Sn Grain Orientation on Electromigration in Flip-chip Interconnections with Sn2.3Ag Solder of 65 μm Thickness

工學院半導體材料與製程設備學程

電遷移、錫晶粒方向、Electromigration、Sn Grain Orientation

Study of Thermomigration in Cu/SnAg/Cu solder joint with different reflow process

平面顯示技術碩士學位學程

微凸塊銲錫、熱遷移現象、液態錫銀銲錫、Microbumps、Thermomigration、Molten SnAg solder

Effect of Sn Microstructure on Electromigration in Flip-Chip Solder Joints

材料科學與工程學系所

電遷移、electromigration

Effect of Sn Microstructure on Electromigration and Thermomigration in Sn2.3Ag Microbumps

材料科學與工程學系所

微凸塊、電遷移、熱遷移、背向散射電子繞射儀、Mircobump、Electromigration、Thermomigration、Electron back-scattering diffratction

Fabrication process of High-aspect-ratio Photo Resist for CMOS Image Sensors

工學院半導體材料與製程設備學程

影像感測元件、高深寬比、光阻、互補式金屬氧化半導體、CIS、High-aspect-ratio、Photo Resist、CMOS

Study of Sn Grain Microstructures on Electromigration Failure Mechanisms.

材料科學與工程學系所

電子封裝、三維積體堆疊、微凸塊、電遷移測試、3D-IC、microbump、Ni-Ni UBM、EM test

Study of Au-to-Au Direct Bonding Using Electroplating Highly (110)-oriented Au Films

材料科學與工程學系所

直接接合、金(110)方向性、Au-to-Au direct bonding、(110)-oriented

Study of the channel formation by Cu-Sn metallurgical reaction

工學院半導體材料與製程設備學程

通道生成、冶金反應、channel formation、metallurgical reaction

Electromigration Study in Flip-chip with 15μm Thick Sn2.3Ag Solder Joints at High Temperatures

工學院半導體材料與製程設備學程

覆晶、銲錫接點、電遷移、Flip-chip、Solder Joints、Electromigration

Study of Reliability Issues in 30-µm Microbumps: Metallurgical Reactions, Electromigration, and Temperature Cycling Tests

材料科學與工程學系所

銲錫、熱處理、電遷移、熱循環測試、Solder、Thermal Aging、Electromigration、TCT Tests

Study of Metallurgical Reactions and Electromigration of 30μm Cu/SnAg/Ni and Cu/SnAg/Cu Microbumps

工學院加速器光源科技與應用學位學程・共同指導：林宏基

焊錫、微凸塊、錫銀接點、銅鎳、銅銅、冶金、電遷移、迴焊、高溫儲存、Solder、Microbumps、SnAg、CuNi、CuCu、Metallurgical、Electromigration、Reflow、Aging

Study of vertical interconnects of 3D IC: Cu3Sn joints and Au-to-Au direct bonding

材料科學與工程學系所

三維積體電路、Cu3Sn、直接接合、通道、介金屬化合物接點、金對金、3DIC、direct bonding、channel、IMC joint、Au-to-Au

Effects of Metallization Materials and Solder Height on Electromigration Failure Mechanism of Microbumps

材料科學與工程學系所

電遷移、微凸塊、介金屬化合物、electromigration、microbump、IMC

Reduction of Forward Voltage of High Power Transient Voltage Suppressor

工學院半導體材料與製程設備學程・共同指導：吳耀銓

突波抑制器、低順向壓降、Transient Voltage Suppressor、low forward voltage drop

Effects of Temperature Cycling Test on Fan-out Wafer Level Package Reliability

工學院半導體材料與製程設備學程

擴散型封裝、晶圓級封裝、溫度循環試驗、推球、推球模式、球墊分離、熱應力、熱衝擊、冷卻速率、Fan-out、WLCSP、Temperature Cycling Test、Ball Shear、Shear Mode、Pad lift、Thermal Stress、Thermal Shock、Cooling Rate

Electromigration tests in Cu/SnAg/Ni/Cu Flip Chip solder joints and Cu/SnAg/Cu microbumps

材料科學與工程學系所

電遷移、覆晶接點、微凸塊接點、Electromigration、Flip chip、Microbumps、solder joints

ElectromigrationStudy on Cu/Al/Ti/Si Schottky Diodes

工學院半導體材料與製程設備學程

銅打線、銅鋁介金屬化合物、電遷移、Copper wire bonding、CuAl IMC、Electromigration

A study on discolor image of CMOS image sensor

工學院半導體材料與製程設備學程

CMOS影像感測器、CMOS image sensor

Fabrication of (111)-oriented nanotwinned Cu by pulsed electroplating and extremely anisotropic Cu (100) single crystal growth during annealing

材料科學與工程學系所

脈衝電鍍、雙晶、晶粒成長、pulse plating、nanotwins、grain growth

Study of Electromigration Reliability in Microbumps of Three-dimensional Integrated Circuit

工學院加速器光源科技與應用學位學程・共同指導：李信義

微凸塊、電遷移、邊牆擴散效應、錫晶粒方向、microbump、electromigration、side-wall diffusion、Sn grain orientation

Study of Thermal Stability of Nanotwinned and Electromigration Failure Mode for Microbumps with Nanotwinned Copper Metallization

材料科學與工程學系所

奈米雙晶銅、熱穩定性、電遷移、微凸塊、nanotwinned copper、thermal stability、electromigration、microbump

Formation of Porous Cu3Sn Intermetallic Compounds at High Temperature in Low-bump-height solder joints

材料科學與工程學系所

電遷移、介金屬化合物、邊牆潤溼效應、electromigration、intermetallic、side wall wetting effect

Electromigration in flip-chip solder joints: Effect of temperature on failure mechanism and analysis of bump resistance curves

材料科學與工程學系所

覆晶銲錫、電遷移、相變化、界金屬化合物、介面反應、電阻曲線、Flip-Chip solder joints、Electromigration、Phase transformation、Intermetallic compound、Interfacial reaction、Resistance curve

Temperature-Dependence Electromigration Failure for Flip-Chip SnAg Solder bumps with 5μm Cu metallization

工學院半導體材料與製程設備學程

電遷移、Electromigration

Electromigration Study in Flip-Chip Sn3.5Ag solder joints with Ni Under-bump-metallization at different temperature

工學院半導體材料與製程設備學程

介金屬化合物、銲錫、電遷移、IMC、Solder、EM

Study of Failure Mechanisms in Flip-Chip Solder Joints and Microbumps under Electromigration Using Kelvin Bump Structures and Finite-Element Analysis

材料科學與工程學系所

覆晶、微凸塊、電遷移、凱文結構、四點量測、凸塊電阻、有限元素法、flip-chip、microbump、electromigration、Kelvin structure、4-point probes、bump resistance、finite-element method

Electromigration and stress migration behaviors in flip-chip solder joints

材料科學與工程學系所

銲錫、電遷移、應力遷移、Soldering、Electromigration、Stress migration

The Effect of Tin Grain Orientations and Grain Boundaries during Current Stressing on Cu6Sn5 Formation

材料科學與工程學系所

錫晶粒方向、錫晶界、電遷移、銲錫、tin grain orientation、tin grain boundary、electromigration、soldering

Improvement of Reliability Issues of Microelectronic Packaging by Controlling the Orientation and Morphology of Cu-Sn Intermetallic Compounds

材料科學與工程學系所

奈米雙晶銅、介金屬化合物、微銲錫凸塊、電子封裝、錫晶鬚、nano-twinned Cu、intermetallics、microbump、electronic packaging、tin whisker

Fabrication and thermal stability of highly (111)-oriented nanotwinned Cu films and their applications in 3D IC packaging

材料科學與工程學系所

奈米雙晶銅、三維積體電路、冶金反應、熱遷移、微凸塊、nano twin Cu、3D IC、inter metallurgy、thermomigration、microbump

In situ doping p-type ZnO thin film prepared by atomic layer deposition

工學院加速器光源科技與應用學位學程・共同指導：古慶順

P型氧化鋅薄膜、原子層沈積系統、P-type ZnO thin films、Atomic layer deposition

Copper Filling of High–Aspect–Ratio TSV and

工學院半導體材料與製程設備學程

高深寬比TSV、熱機械應力、電鍍、High–Aspect–Ratio TSV、Thermo–Mechanical Stress、electroplating

To inhibit the growth of Cu6Sn5 during reflow using Cu-Sn compounds as a diffusion barrier

材料科學與工程學系所

介金屬化合物、銲錫、銅、IMC、solder、Cu

Effect of stressing temperature on the electromigration degradation mechanisms of flip-chip Sn-2.5Ag

工學院半導體材料與製程設備學程

覆晶銲錫、電遷移、Flip-chip、electromigration

Study of electromigration failure mode in flip-chip solder joints with copper columns using Kelvin bump

工學院加速器光源科技與應用學位學程・共同指導：李信義

電遷移、覆晶焊錫、厚銅金屬墊層、Electromigration、Flip-chip、Copper column

Effect of Solder Thickness on Electromigration on Sn2.3Ag Solder Joints

材料科學與工程學系所

銲錫厚度、錫銀銲錫、電遷移效應、Solder Thickness、Sn2.3Ag Solder、Electromigration

The electromigration failure mode of low-bump-height Sn2.3Ag solder with different under-bump-metallizations

材料科學與工程學系所

電遷移、低銲錫厚度、electromigration、low-bump-height

Study of Thermomigration of Cu and Ni in Molten SnAg Microbumps

材料科學與工程學系所

微凸塊銲錫、熱遷移現象、液態錫銀銲錫、Microbumps、Thermomigration、Molten SnAg solder

Crack Formation after Thermal Cycling Tests for Sn2.3Ag Microbumps with Different Under-Bump-Metallization Structures

工學院加速器光源科技與應用學位學程・共同指導：林宏基、鄭裕庭

三維積體電路、微凸塊、熱循環測試、介金屬化合物、3D IC、Microbump、Thermal Cycling、IMC

How process parameters influenced step coverage performance of sputtered Titanic thin-film in TSV of 3D-IC

工學院半導體材料與製程設備學程

鈦、賤鍍、通孔、覆蓋率、直通矽晶穿孔、Ti、sputter、via、TSV、step coverage

Electromigration Failure Modes Study in Flip-Chip SnAg Solder Joints under Constant-Temperature / Different-Current Density Condition

工學院半導體材料與製程設備學程

電遷移、覆晶銲錫接點、錫銀、熱遷移、electromigration、flip chip solder joints、SnAg、thermomigration

Effect of different SnAg thickness on interfacial reactions in microbumps of Ni/SnAg/Cu

材料科學與工程學系奈米科技碩博士班・共同指導：許鉦宗

錫銀銲錫、鎳/錫銀/銅、微凸塊、介面反應、SnAg、Ni/SnAg/Cu、microbumps、interfacial reactions