碩士平均畢業時長
2.11 年
中位數 2.01 年・70 人
在職專班平均畢業時長
2.13 年
中位數 2.04 年・4 人
博士平均畢業時長
6.16 年
中位數 6.37 年・25 人
收錄論文
110 篇
100–115 學年度
全校中位數（供對照）
碩士 2.10・在職專班 2.08・博士 6.11 年
畢業時長趨勢
每學年度畢業人數
只計入有論文收錄的畢業生；中途休學或更換指導教授的學生不會出現在這裡。
研究關鍵字
三維積體電路3DIC異質整合3D IChybrid bondingheterogeneous integrationAdvanced packaging先進封裝Temporary Bonding暫時性接合混合接合低溫銅對銅接合Low Temperature Bonding熱壓接合鈍化層結構Passivation structure低溫接合積層型三維積體電路3D-IC矽穿孔Thermocompression Bonding低熱預算Low Thermal BudgetLow temperature Cu-Cu bonding低溫混合接合Low-temperature hybrid bonding超薄緩衝層銅接合TSV3D Integration晶圓薄化Ultra-thin Buffer layer無電鍍沉積技術低溫接合技術銅對銅接合passivation layer混和接合Adhesion晶圓接合雷射解膠Backside Silicon RemovalLaser Debonding有限元素分析Finite Element AnalysisElectroless-plated techniqueMonolithic 3D-IClow temperature bonding technologyThree-dimensional integrated circuit可靠度Reliability
想看最新的研究方向與計畫經費，也可以查政府研究計畫（GRB）。
指導論文
| 學年度 | 論文 | 學制 | 入學 | 提交日期 | 畢業時長 |
|---|---|---|---|---|---|
| 115 | Deep Learning-Based Octagonal Moiré Alignment (DLOMA) and Domain Adaptation for High-Precision 3DIC Bonding 國際半導體產業學院 三維積體電路、深度學習、莫耳對準、領域自適應、數位雙生、超薄層轉移技術、晶圓薄化、氧化層接合、精準對位、暫時性接合、雷射解膠、3D IC、Deep Learning、Moiré Alignment、Domain Adaptation、Digital Twin、Ultra-Thin Layer Transfer、Backside Silicon Removal、Oxide Bonding、Precise Alignment、Temporary Bonding、Laser Debonding | 碩士 | 113 | 2026-10-22 | 2.22 年 |
| 115 | Process Development of BSPDN Bonding Interface and TGV Microfluidic Channel Structure for Thermal Dissipation in 3D Heterogeneous Integration Packaging 前瞻半導體研究所 晶背供電、三維積體電路、高導熱異質接合、熱壓接合、玻璃通孔、微流道、Backside Power Delivery Network、3D IC、High-Thermal-Conductivity Heterogeneous Bonding、Thermocompression Bonding、TGV、Microfluidic Channel | 碩士 | 113 | 2026-10-21 | 2.22 年 |
| 115 | Localization-Guided Functional RTL Debugging with Large Language Models 國際半導體產業學院・共同指導：劉建男 暫存器傳輸層級、功能性 RTL 除錯、錯誤定位、大型語言模型、自動化 RTL 修復、Register-Transfer Level、Functional RTL Debugging、Functional Error Localization、Large Language Models、Automated RTL Repair | 碩士 | 113 | 2026-09-18 | 2.13 年 |
| 114 | Advanced Thermal Management for Thin 3D Integration Using an AlN-Based 3D Heat Dissipation Network 電子研究所 薄型三維技術、三維積體電路、氮化鋁、熱管理、散熱模擬、熱導係數量測、雷射退火、Thin 3D、3DIC、AlN、Thermal management、COMSOL simulation、TDTR measurement、Laser annealing | 碩士 | 113 | 2026-07-28 | 1.99 年 |
| 114 | Next-Generation Optical-Electrical Co-Design Interconnect Using Low-Temperature Hybrid Bonding Technology 電子研究所 三圍積體電路、光電整合中介層、有機波導、低溫混合接合、層轉移、可靠度驗證、Advanced packaging、Optical-electrical co-design interposer、Polymer waveguide、Hyper RDL、Low-temperature hybrid bonding、Layer transfer、Reliability test verification | 碩士 | 113 | 2026-07-28 | 1.99 年 |
| 114 | Process Development and Simulation of Low Thermal Budget, Locally Heated Elevated-Epitaxy Technique of Silicon Film using Green Nanosecond Laser for Monolithic 3D Integration 前瞻半導體研究所 積層型三維積體電路、雷射液相磊晶、單晶矽、有限元素分析、低熱預算、光學調控、局部加熱、Monolithic 3D ICs、Laser Liquid Phase Epitaxy、Single-Crystalline Silicon、Finite Element Analysis、Low Thermal Budget、Optical Modulation、Local Heating | 碩士 | 112 | 2026-02-25 | 2.57 年 |
| 114 | Advanced Cu/Polymer Hybrid Bonding and Hyper RDL (HRDL) Interposer Platform for Heterogeneous Integration Application 電子研究所 混合接合、層轉移技術、中介層、重新分佈層、低 溫接合、異質整合、三維積體電路、hybrid bonding、transfer bonding、interposer、redistribution layer、low-temperature bonding、heterogeneous integration、3D IC | 博士 | 111 | 2025-09-25 | 3.15 年 |
| 114 | Structure Testing and Technology Development of Au-Sn Solid–liquid Interdiffusion Bonding Applied to 3D Integrated Circuits 國際半導體產業學院・共同指導：許恒通 三維積體電路、微機電系統、先進封裝、金錫介金屬化合物、固液擴散接合、Three-dimensional integrated circuits、Micro electro mechanical systems、Advanced packaging、Gold-tin intermetallic compounds、Solid-liquid interdiffusion bonding | 碩士 | 111 | 2025-08-31 | 3.08 年 |
| 114 | High Thermal Performance BSPDN Scheme Utilizing 3DIC Technology 工學院專班-半導體材料與製程設備學程・共同指導：吳文偉 晶背供電、三維積體電路、⾼導熱異質接合、熱模擬、熱壓接合、Backside Power Delivery Network、Three-Dimensional Integrated Circuit (3DIC)、High-Thermal-Conductivity Heterogeneous Bonding、Thermal Simulation、Thermo-Compression Bonding (TCB) | 碩士在職專班 | 112 | 2025-08-15 | 2.04 年 |
| 114 | Investigation of Low-temperature Co-Co Bonding with Metal Passivation for Advanced Packaging and Ultra-Fine Pitch Applications 電子物理學系・共同指導：陳衛國 三維積體電路、先進封裝、低溫鈷對鈷接合、熱壓接合、鈍化層結構、3DIC、Advanced packaging、Thermocompression bonding、Low temperature Co-Co bonding、Passivation structure | 碩士 | 112 | 2025-08-15 | 2.04 年 |
| 114 | Thin 3D: Development of an Innovative Ultra-Thin Wafer-Level Active Device Transfer Technology with Integrated Thermal Solution for 3D IC 電子研究所 三維積體電路、超薄層轉移技術、晶圓薄化、氧化層接合、精準對位、暫時性接合、雷射解膠、散熱層、3D IC、Ultra-Thin Layer Transfer、Backside Silicon Removal、Oxide Bonding、Precise Alignment、Temporary Bonding、Laser Debonding、Heat Dissipation Layer | 碩士 | 112 | 2025-07-18 | 1.96 年 |
| 113 | Fabrication Optimization and Reliability Assessment of Novel Stackable RDL Interposer for Advanced Packaging and Heterogeneous Integration 電子研究所 三維積體電路、HRDL、雷射熱累積優化、製程優化、可靠度評估、低溫混合接合、可堆疊中介層平台、異質整合、3DIC、Hyper Redistribution Layer、Laser thermal accumulation optimization、Process optimization、Reliability verification、Stackable redistribution layer interposer、Heterogeneous integration、Low-temperature hybrid bonding | 碩士 | 112 | 2025-07-18 | 1.96 年 |
| 113 | Development of Eutectic and Low-temperature Bonding Technologies Using Ultra-Thin Buffer Layers in Au-Sn Intermetallic Compound Structures for 3D Integrated Circuits Applications 前瞻半導體研究所 三維積體電路、金錫介金屬化合物、超薄緩衝層、共晶點接合、低溫金錫介金屬化合物接合、3D Integrated Circuits、Au-Sn Intermetallic Compound、Ultra-thin Buffer layer、Eutectic Bonding、Low-Temperature Au-Sn Bonding | 碩士 | 112 | 2025-06-26 | 1.90 年 |
| 113 | The Development of Wafer-Scale Monolithic 3D Integration of Middle-End-Of-Line FinFETs with Laser-Annealing Single-Crystal Silicon Channel 國際半導體產業學院・共同指導：鄭晃忠 積層型三維積體電路、單晶矽、晶圓級結晶、低熱預算、雷射誘導結晶、Monolithic 3D Integration、Single-Crystal Silicon、Wafer-Scale Crystallization、Low Thermal Budget、Laser-Induced Crystallization | 博士 | 107 | 2025-04-09 | 6.69 年 |
| 113 | Development of Low-Temperature Cu-Cu Bonding Platform with Sequential Stacking Capability Using Area-selective Metal Passivation Technology 電子研究所 三維積體電路、異質整合、先進封裝、鈍化層結構、低溫銅對銅接合、熱穩定性、無電鍍沉積技術、低溫混合接合、3DIC、Heterogenous integration、Advanced packaging、Passivation structure、Low temperature Cu-Cu bonding、Thermal stability | 博士 | 109 | 2024-11-13 | 4.28 年 |
| 113 | Investigation of Room Temperature Polymer Bonding on Flexible Substrates and Low-temperature Cu/Polymer Hybrid Bonding with Area-Selective Passivation Layer 電子研究所 三維積體電路、室溫可撓性基板接合、低溫混和接合、高分子複合材料、化學機械拋光、化學鍍銀、3D Integrated Circuits、Room Temperature Flexible Substrate Bonding、Low-Temperature Hybrid Bonding、Polymer Composites、Chemical Mechanical Polishing、Electroless Silver Plating | 碩士 | 111 | 2024-09-26 | 2.15 年 |
| 113 | Evaluating Signal Integrity in InFO Package via Learning-based Methods 國際半導體產業學院・共同指導：陳宏明 訊號完整度、InFO封裝、第三代高頻寬記憶體、XGBoost、LightGBM、Gurobi最佳化器、Signal Integrity、InFO Package、High Bandwidth Memory 3、Gurobi Optimizer | 碩士 | 111 | 2024-09-23 | 2.15 年 |
| 113 | Develpoment of Novel Stackable RDL Interposer Using Layer Transfer Technique and Low-Temperature Hybrid Bonding Technology 前瞻半導體研究所 三維積體電路、無電鍍沉積技術、低溫混合接合、鈍化層結構、可堆疊中介層平台、異質整合、3DIC、Electroless-plated technique、Low-temperature hybrid bonding、Passivation structure、Stackable redistribution layer interposer、Heterogeneous Integration | 碩士 | 111 | 2024-08-19 | 2.05 年 |
| 113 | Development of Low-temperature Hybrid Bonding Using Area-selective Passivation Layer Deposition Technology with Material Characteristics and Electrical Reliability Investigation 國際半導體產業學院 三維積體電路、無電鍍沉積技術、低溫銅對銅接合、鈍化層結構、低溫混合接合、3DIC、Electroless-plated technique、Low-temperature Cu-Cu bonding、Passivation structure、Low-temperature hybrid bonding | 碩士 | 111 | 2024-08-17 | 2.05 年 |
| 113 | Process Development and Simulation Analysis of Low Thermal Budget Technique using Green Nanosecond Laser to Germanium Film Crystallization for Monolithic 3D ICs 電子研究所 積層型三維積體電路、綠光奈秒雷射、單晶鍺、鰭式電晶體、低熱預算、有限元素分析、Monolithic 3D-IC、Green Nanosecond Laser Crystallization、Single-Crystal Ge、FinFET、Low Thermal Budget、Finite Element Analysis | 碩士 | 111 | 2024-08-16 | 2.04 年 |
| 113 | Enhancement of Thermal Stability in Low-temperature Cu-Cu Bonding by Metal Passivation Layer and Investigation of Interface Microstructure Impact on Reliability 電子研究所 三維積體電路、熱壓接合、先進封裝、鈍化層結構、低溫銅對銅接合、熱穩定性、3DIC、Thermocompression bonding、Advanced packaging、Passivation structure、Low temperature Cu-Cu bonding、Thermal stability | 碩士 | 111 | 2024-08-08 | 2.02 年 |
| 113 | Development of Polymer for Fan-Out Packaging and Low Temperature Bonding 電子研究所 先進封裝、感光型聚醯亞胺、黏著劑、附著強度研究、低溫接合技術、advanced packaging、photosensitive polyimide、adhesion strength investigation、low temperature bonding technology、adhesive | 碩士 | 109 | 2024-01-06 | 3.43 年 |
| 112 | Development of Novel Polymer Materials for Low Temperature Polymer-based Hybrid Bonding, Low Warpage 2.5D Organic Interposer and Fan-out Advanced Packaging Technology 電子研究所 先進封裝、混合接合、低熱預算、低溫接合技術、金屬鈍化層、感 光型聚醯亞胺、線路重佈中介層、advanced packaging、hybrid bonding、low thermal budget、low temperature bonding technology、metal passivation、photosensitive polyimide (PSPI)、re-distribution layer (RDL) interposer | 博士 | 107 | 2024-07-02 | 5.92 年 |
| 112 | Selection of 355-nm Laser Debonding Material to Enable RDL-first and Die-first Fan-out Integrations 國際半導體產業學院 雷射脫模、扇出型晶圓級封裝技術、扇出型面板級封裝技術、重分佈層、重分佈層優先、晶片優先、內埋式中介層載板、異質整合、Laser Debonding、Fan-Out Wafer Level Packaging (FOWLP)、Fan-Out Panel-level Packaging (FOPLP)、Redistribution layers (RDLs)、RDL-first、Die-first、Embedded Interposer Carrier (EIC)、Heterogeneous Integration | 博士 | 106 | 2023-12-27 | 6.40 年 |
| 112 | Development on Low Temperature Hybrid Bonding Technology with TSV Integration for Advanced Memory Packaging Platform 電子研究所 混合接合、低溫接合技術、記憶體封裝、矽穿孔整合、hybrid bonding、low temperature bonding technology、memory packaging、TSV integration | 博士 | 107 | 2023-11-14 | 5.29 年 |
| 112 | Study on Laser-Crystallized Silicon and Germanium Field-Effect Transistors for Monolithic Three-Dimensional Integrated Circuits 電子研究所・共同指導：鄭晃忠 積層型三維積體電路、穿隧式電晶體、綠光奈秒雷射結晶、多晶矽、單晶鍺、鰭式電晶體、低熱預算、Monolithic 3D ICs、Tunneling FET、Green Nanosecond Laser Crystallization、Poly-Si、Single-Crystal Ge、FinFET、Low Thermal Budget | 博士 | 105 | 2023-10-03 | 7.17 年 |
| 112 | Development of Advanced Dielectric and Metal Material for Hybrid Bonding in 3D Integration 國際半導體產業學院 三維積體電路、先進封裝、氮氧化矽、氮化矽、氮化銅、熱預算、3DIC、Advanced Packaging、Silicon Oxynitride、Silicon Nitride、Copper Nitride、Thermal Budget | 碩士 | 110 | 2023-09-01 | 2.08 年 |
| 112 | Investigation of Room Temperature Polymer Bonding on Flexible Substrate and Low Temperature Polymer-Cu Hybrid Bonding with Au Passivation 電子研究所 三維積體電路、黏合性高分子、複合材料、可撓性基板接合、混合接合、3D-IC、Adhesive polymer、Composite material、Flexible substrate bonding、Hybrid bonding | 碩士 | 110 | 2023-09-01 | 2.08 年 |
| 112 | Development of Backside Silicon Removal for Transparent Ultra-thin Wafer-Level Active Layer Transfer by SOI-based Temporary Bonding Scheme 電子研究所 三維積體電路、暫時性接合、晶圓薄化、晶背移除技術、超薄主動層轉移技術、矽濕蝕刻、3D-IC、Temporary Bonding、Wafer Thinning、Backside Silicon Removal、Ultra-Thin Layer Transfer Technology、Silicon Wet Etching | 碩士 | 111 | — | 無法計算 |
| 111 | Development of Novel Electroless-Plated Passivation Layer Deposition Technology Platform for Low-Temperature Copper-to-Copper Bonding Structure with Material Analysis and Reliability Investigation 前瞻半導體研究所 三維積體電路、無電鍍沉積技術、低溫銅對銅接合、鈍化層結構、電漿前處理、3DIC、Electroless-plated technique、Low-temperature Cu-Cu bonding、Passivation structure、Plasma pretreatment | 碩士 | 110 | 2023-07-22 | 1.97 年 |
| 111 | Development of Low-Temperature Hybrid Bonding Technology by Temporary Bonding Method for Novel Stackable Interposer Integration Platform 電子研究所 三維積體電路、暫時性接合、混合接合、可堆疊中介層整合平台、異質整合、3D-IC、Temporary Bonding、Hybrid Bonding、Stackable Interposer Integration Platform、Heterogeneous Integration | 碩士 | 110 | 2023-06-26 | 1.90 年 |
| 111 | Investigation of Bonding Mechanism and Quality Enhancement Approach for Low-Temperature Cu–Cu Bonding with Passivation Technology 國際半導體產業學院 先進封裝、三維積體電路、熱壓接合、低溫銅對銅接合、鈍化層結構、Advanced packaging、3DIC、Thermocompression bonding、Low temperature Cu-Cu bonding、Passivation structure | 碩士 | 110 | 2023-04-23 | 1.72 年 |
| 111 | Development of Plasma-assisted Au-to-Au Bonding Technology and Ultra-thin Wafer Temporary Bonding Technology for Miniaturized MEMS Vacuum Packaging 國際半導體產業學院 3DIC、玻璃、金對金接合、三層堆疊接合、暫時性接合、glass、gold-to-gold bonding、triple-layer wafer to wafer bonding、temporary bonding | 碩士 | 109 | 2023-04-09 | 2.69 年 |
| 111 | Investigation of Bonding Mechanism and Novel Scheme Development of Cu-Cu Bonding with the Passivation Structure 國際半導體產業學院 異質整合、三維積體電路、Micro-LED、銅對銅接合、鈍化層結構、Heterogenous integration、Three-dimensional integrated circuit、Cu-Cu direct bonding、Passivation structure | 博士 | 107 | 2023-03-06 | 4.59 年 |
| 111 | Development of Low Thermal Budget Cu-Cu Bonding by Au Passivation Structure for Multichip Integration Platform 電子研究所 三維積體電路、先進封裝、熱壓接合、低溫銅對銅接合、多晶片接合、鈍化層接合、3D-IC、Advanced packaging、Thermocompression bonding、Low temperature Cu-Cu bonding、Multi-chip bonding、Passivation bonding | 碩士 | 110 | 2022-11-29 | 1.33 年 |
| 111 | Application of Ti-wetting and Au-passivation Layer in Cu to Cu Low Temperature Bonding for the Development of 3D Integrated Circuits 電子研究所・共同指導：鄭晃忠 三維積體電路、銅對銅低溫接合、鈍化層技術、3D IC、Cu-Cu low temperature bonding、passivation technology | 碩士 | 108 | 2022-10-11 | 3.20 年 |
| 110 | Development of wafer-level polymer bonding for 3D heterogeneous integration application 電子研究所 三維積體電路、晶圓級封裝、高分子接合、低溫製程、異質整合、3D-IC、Wafer-Level packaging、Polymer bonding、Outgassing、Low temperature process、Heterogeneous integration | 碩士 | 109 | 2022-09-14 | 2.12 年 |
| 110 | Development of Low-thermal-budget and Low-electrical-loss Heterogeneous Integration Platform by Using Laser-induced Through Glass Via and Electroless-plated Passivation Technology 電子研究所 三維積體電路、玻璃中介層、化學鍍技術、銅對銅接合、可靠度、3DIC、Glass interposer、Electroless-plated、Cu-to-Cu bonding、Reliability | 碩士 | 109 | 2022-07-25 | 1.98 年 |
| 110 | Development of Low-Temperature Cu-Cu Bonding with Ag-Base Passivation Layer Technology for 3D Integrated Circuits 國際半導體產業學院 先進封裝、三維積體電路、熱壓接合、低溫銅對銅接合、鈍化層材料、Advance Packaging、3DIC、Thermocompression Bonding、Low Temperature Cu-Cu Bonding、Passivation Material | 碩士 | 109 | 2022-07-05 | 1.92 年 |
| 110 | The effect of temperature cycling loadings on the microjoint characteristic life estimation of 3D ICs packaging structure 理學院應用科技學程・共同指導：李昌駿 三維晶片封裝、異質整合、有限元素法、特徵壽命、疲勞壽命、3D-ICs Packaging、Heterogeneous Integration、Finite Element Method、Characteristic Life、Fatigue Life | 碩士在職專班 | 108 | 2022-02-22 | 2.56 年 |
| 110 | Development of Low-temperature Cu-Cu Direct Bonding Technology Based on Passivation Scheme 電子研究所 三維積體電路、銅接合、鈍化層、金屬擴散、潤濕層、混合接合、3D IC、Cu bonding、passivation layer、metal diffusion、wetting layer、hybrid bonding | 博士 | 104 | 2021-12-13 | 6.37 年 |
| 110 | Development of Advanced Packaging Technology for Heterogeneous Integration Platform and Next-generation Microelectromechanical Systems 電子研究所 三維積體電路、銅對銅接合、晶片級堆疊、晶圓級堆疊、無凸塊技術、矽穿孔、Three-dimensional integration、Cu-Cu bonding、chip stacking、bumpless、wafer-on-wafer (WOW)、through-silicon via (TSV) | 博士 | 105 | 2021-12-06 | 5.35 年 |
| 110 | Study on Ferroelectricity of the Undoped Hafnium Oxide Thin Films 電子研究所・共同指導：鄭晃忠 鐵電性、無摻雜氧化鉿、鐵電記憶體、鐵電電晶體、類神經、氧空缺、原子層化學沉積、ferroelectricity、undoped-HfO、ferroelectric memory、ferroelectric FET、synaptic、oxygen vacancy、atomic layer deposition | 博士 | 104 | 2021-09-22 | 6.14 年 |
| 109 | Warpage Estimation of the laminated packaging substrate with Cu pillar structure considering material characteristics 理學院應用科技學程・共同指導：李昌駿 彎翹模擬估算、異質整合封裝、有限元素分析、層疊封裝疊構載板、材料等效方法、Warpage estimation、Heterogeneous integrated packaging、Finite element analysis、Laminated packaging substrate、Equivalent material approach | 碩士在職專班 | 108 | 2021-06-17 | 1.88 年 |
| 109 | Miniaturization of Glass-based Advanced Packaging Based on Ultrathin Wafer-level Bonding 3D-IC Technology 電子研究所 晶圓級接合、先進封裝、封裝微縮、極薄玻璃、三維積體電路、Wafer-level Bonding、Advanced Packaging、Package Miniaturization、Ultrathin Glass、3D-IC | 碩士 | 108 | 2021-05-25 | 1.82 年 |
| 109 | Development of Capacitance Extraction Model and Electrical Performance with Reliability Investigation in Advanced Packaging for 3D Integrated Circuit Applications 電子研究所 三維積體電路、先進封裝、可靠度、3DIC、Advanced Packaging、Reliability | 碩士 | 108 | 2021-03-30 | 1.66 年 |
| 109 | Development of Biocompatible Heterogeneous Integration Platform based on Three-Dimensional Integrated Technology 國際半導體產業學院 異質整合、三維積體電路、Heterogeneous Integration、3D IC | 碩士 | 108 | 2021-02-23 | 1.57 年 |
| 109 | Application of Ti-wetting and Ag-passivation layer in developing Cu to Cu low temperature bonding for 3D Integrated Circuits 電子研究所 三維積體電路、鈦濕潤層、銅對銅接合、銀鈍化層、3DIC、Ti-wetting layer、Cu to Cu bonding、Ag-passivation layer | 碩士 | 108 | 2021-02-05 | 1.52 年 |
| 109 | Study on the Electrical Characteristics of Low-Temperature-Polycrystalline-Silicon Optical Detectors in Biometric System and the Effects of X-ray Aging 電子研究所・共同指導：鄭晃忠 薄膜電晶體、低溫多晶矽結晶、光偵測器、X光老化、Thin film transistor、Low temperature polycrystalline silicon、Optical detector、X-ray aging | 博士 | 100 | 2021-02-01 | 9.51 年 |
| 109 | Study on the Ferroelectric Characteristics of Un-Doped HfO2 Devices with Different Annealing Temperatures and Structures 國際半導體產業學院・共同指導：鄭晃忠 鐵電材料、鐵電特性、氧化鉿、無摻雜、溫度、結構、ferroelectric material、ferroelectricity、hafnium oxide、undoped、temperature、structure | 碩士 | 107 | 2020-10-09 | 2.19 年 |
| 109 | Study on Enhancing the Ferroelectric Properties of Undoped HfO2-Based Devices via Oxygen Vacancies and Capping Effects 電子研究所・共同指導：鄭晃忠 鐵電記憶體、鐵電場效電晶體、氧化鉿、氧空缺、無摻雜、Ferroelectric、FeFET、HfO2、Undoped、Oxygen vacancies | 碩士 | 107 | 2020-10-07 | 2.18 年 |
| 109 | Study on the Characteristics of Low-Temperature Polycrystalline-Silicon Thin-Film Transistors with the Location-Controlled Grain Boundary via Green Nanoseconds-Laser Crystallization 電子研究所・共同指導：鄭晃忠 綠光奈秒雷射結晶、低溫多晶矽薄膜電晶體、凹陷型通道結構、Green nanosecond-pulse laser crystallization、LTPS-TFT、Recessed-channel Structure | 碩士 | 107 | 2020-10-07 | 2.18 年 |
| 109 | Development and Simulation of Lowering Thermal Budget Technology Platform on Stacking/Monolithic 3D Integrated Circuits 電子研究所 堆疊型三維積體電路、銅接合、鈍化層、晶片級接合、積層型三維積體電路、熱模擬、長晶控制技術、Stacking 3D-IC、Copper Bonding、Passivation Layer、Chip-level Bonding、Monolithic 3D-IC、Thermal analysis、Location-Controlled Grain | 碩士 | 107 | 2020-08-14 | 2.04 年 |
| 109 | Investigation and Discussion on Passivation Bonding and Asymmetric Bonding Structure of Low Temperature Cu-Cu Direct Bonding in 3D Heterogeneous Integration 電子研究所 三維積體電路製造技術、低溫銅對銅直接接合、Three-dimensional integrated circuit、Low temperature copper-copper direct bonding | 博士 | 104 | 2020-01-12 | 4.45 年 |
| 109 | Development of Novel Material and Bonding Technology for Fan-Out Advanced Packaging 電子研究所 先進封裝、附著強度研究、低溫接合、Advanced Packaging、Adhesion Test、Low Temperature Bonding | 碩士 | 108 | — | 無法計算 |
| 109 | Development of Plasma Activation Technique for Low Temperature Fusion Bonding of Silicon Dioxide in 3D Integration 電子研究所 熔融接合、熱預算、矽烷醇基、電漿活化、表面親水性、Fusion Bonding、Silanol Groups、Thermal Budget、Plasma Activation、Surface Hydrophilicity | 碩士 | 108 | — | 無法計算 |
| 109 | Development of Non-Copper Metal Bonding Technology Platform for 3D Integrated Circuits 電子研究所・共同指導：鄭晃忠 三維積體電路、熱壓接合技術、鈷金屬、銅對鋁接合、鈍化層技術、異質整合、Three dimensional integrated circuit (3D IC)、Thermo compression bonding (TCB)、Cobalt、Cu-Al metal bonding、Passivation layer、Heterogeneous bonding | 碩士 | 108 | — | 無法計算 |
| 109 | Low-Temperature Copper-to-Copper Bonding Technology with Passivation Layer Materials for 3D Integrated Circuits 電子研究所・共同指導：鄭晃忠 三維積體電路、銅對銅低溫接合技術、新穎鈍化層材料開發、擴散接合技術、擴散理論機制、熱壓接合、3D IC、TCB、Copper-to-Copper bonding、Diffusion bonding、Bonding technology with the passivation layer、Low-temperature bonding technology、Diffusion mechanism、Solid-state diffusion、Novel passivation material、Cu to Cu bonding | 碩士 | 108 | — | 無法計算 |
| 109 | Development of Strengthened Copper to Copper Bonding Technology for 3D Integrated Circuits 電子研究所 銅對銅、銅酸處理、混和式接合、Cu to Cu、Cu acid pretreatment、Hybrid bonding | 碩士 | 107 | — | 無法計算 |
| 108 | Development of Low Temperature Copper to Copper Bonding Technology with Pt Passivation Platform for 3D Integrated Circuits 理學院應用科技學程 三維積體電路、低溫銅對銅接合、鉑鈍化層、3D IC application、Low temperature Cu-Cu bonding、Pt metal passivation | 碩士在職專班 | 107 | 2020-08-15 | 2.04 年 |
| 108 | Development of Advanced Frequency Resonator Devices based on Three-Dimensional Integrated Circuit Technology 國際半導體產業學院 石英、頻率震盪元件、三維積體電路、晶圓級接合、暫時性接合、微機電封裝、Quartz、Frequency Resonator、3D IC、Wafer-Level Bonding、Temporary Bonding、MEMS Package | 碩士 | 107 | 2020-07-21 | 1.97 年 |
| 108 | Study on the Graphite-Structured Nanomaterials and Metal Oxides for the Applications in High-Performance Supercapacitors 電子研究所・共同指導：鄭晃忠 奈米碳管、金屬氧化物、低溫水熱法、超級電容、Carbon Nanotubes、Metal Oxides、Low-temperature Hydrothermal method、Supercapacitors | 博士 | 106 | 2020-07-03 | 2.92 年 |
| 108 | Study on the Resistive Switching Characteristics and Synaptic Behaviors of HfOx-based RRAM Devices 電子研究所・共同指導：鄭晃忠 電阻式記憶體、雙層阻值結構、類神經運算、仿生運算、電子突觸元件、Resistive Random Access Memory、Bilayer RRAM、Filament type、Neuromorphic computing、Synaptic device | 碩士 | 106 | 2020-02-23 | 2.56 年 |
| 108 | Development of Well-Defined Single-Grain Silicon Matrix based on novel Location-Controlled-Grain Technology for Monolithic 3D integrated FinFET Circuits 國際半導體產業學院 長晶控制技術、積層型三維積體電路、Location-Controlled-Grain Technology、Monolithic 3DIC | 碩士 | 107 | — | 無法計算 |
| 108 | Process Development and Simulation Analysis for Lowering Thermal Budget on Stacking/Monolithic 3D Integrated Circuits 國際半導體產業學院 三維積體電路、低溫銅對銅接合、熱傳導分析、低熱預算、銀鈍化層、3D IC、low-temperature Cu-to-Cu bonding、thermal conduction analysis、low thermal budget、Ag passivation | 碩士 | 106 | — | 無法計算 |
| 108 | Development and Application of AuSn Eutectic and Au-Au Bonding Technology with Diffusion Barrier Layer in 3D Integration Platform 電子研究所 金錫、AuSn | 碩士 | 107 | — | 無法計算 |
| 108 | Investigation on the Electrical Characterization and Reliability of Wafer-level Bumpless Through Silicon Via 國際半導體產業學院 三維積體電路、矽穿孔、晶圓級、可靠度、3DIC、Through Silicon Via、Wafer level、Reliability | 碩士 | 105 | — | 無法計算 |
| 107 | 2.5D Heterogeneous Integration Platform of Fingerprint Sensor Using Self-Assembly Technologies 國際半導體產業學院 三維積體電路、自我對準、2.5D Heterogeneous Integration、Self-Assembly | 碩士 | 106 | 2019-06-26 | 1.90 年 |
| 107 | Application and Material Properties of Low Thermal Budget Polyimide in Asymmetric Cu/Sn Hybrid Bonding in 3D Integration Platform 電子研究所 混和接合、聚醯亞胺、附著力、非對稱、晶圓級、Hybrid bonding、Polyimide、Adhesion、Asymmetric、Wafer-level | 博士 | 101 | 2019-06-25 | 6.90 年 |
| 107 | Process Development and Device Electrical Investigation of Novel Location-Controlled Grain Technique for Monolithic 3D IC 電子研究所 積層型三維積體電路、鰭式場效電晶體、陣列式奈米級孔洞、綠光奈秒雷射、長晶控制技術、Monolithic 3D-IC、BEOL FinFETs、Cooling holes、Green nanosecond pulse-laser、Location-Controlled Grain | 碩士 | 106 | 2019-06-23 | 1.89 年 |
| 107 | Development of Low Temperature Copper to Copper Bonding Technology Platform for 3D Integrated Circuits 電子研究所 銅接合、低溫接合技術、三維積體電路、鈍化層、濕潤層、晶圓級/晶片級接合、Copper Bonding、Low Temperature Bonding、3D Integrated Circuit、Passivation Layer、Wetting Layer、Wafer-level/Chip-level Bonding | 碩士 | 106 | 2019-06-19 | 1.88 年 |
| 107 | Development and Optimization Investigations of Ultra-Thin Buffer Layers Applied to Cu/Sn Bonding 電子研究所 三維積體電路、銅錫接合、超薄緩衝層、3-D IC、Cu/Sn bonding、ultra thin buffer layer | 博士 | 96 | 2018-11-21 | 11.31 年 |
| 107 | Adhesion Properties of Polyimide for Metal/Polymer Hybrid Bonding and Copper Electroplating in 3D Integration 國際半導體產業學院 聚醯亞胺、附著強度、銅電鍍、三維積體電路、adhesion、polyimide、copper electroplating、3-D IC | 碩士 | 105 | 2018-09-16 | 2.12 年 |
| 106 | Process Development and Electrical Investigation of Pillar-Concave Structure for Low Temperature Cu-Cu Direct Bonding in 3D Heterogeneous Integration 電子研究所 三維積體電路、設計結構、低溫結合、銅接合、3D IC、Pillar-concave structure、Low temperature bonding、Cu-Cu bonding | 碩士 | 106 | 2018-06-21 | 0.89 年 |
| 106 | Application of Polyimide in Asymmetry Cu/Sn Hybrid Bonding for 3D Heterogeneous Integration 電子研究所 混合式異質接合、三維積體電路、聚醯亞胺、銅錫金屬、Hybrid Bonding、3D Heterogeneous Integration、Polyimide、Cu/Sn | 碩士 | 105 | 2018-06-20 | 1.88 年 |
| 106 | Development and Applications of Terahertz Optical Components Using 3D-IC Technologies 電子研究所 三維積體電路、晶圓接合、矽穿孔、兆赫波、異質整合、金屬微接點、3D integrated circuit (3D-IC)、wafer bonding、through Si via (TSV)、Terahertz、heterogeneous integration、solder micro-bump | 博士 | 100 | 2018-02-04 | 6.51 年 |
| 106 | Development and Investigation of 3D-IC Heterogeneous Integration Platforms and Fan-out Wafer Level Package Technologies 電子研究所 三維積體電路、扇型封裝、矽穿孔、異質整合、three-dimensional integrated circuits、Fan-out、through silicon via、heterogeneous integration | 博士 | 99 | 2018-01-30 | 7.50 年 |
| 105 | Investigation of Temporary Bonding with Laser Release Technology for 3D Heterogeneous Integration Platform 電子研究所 三維積體電路、暫時性接合、雷射解膠、異質整合、3D IC、Temporary bonding、Laser release、Heterogeneous integration | 博士 | 98 | 2017-06-21 | 7.89 年 |
| 105 | Development and Investigation of Ultra-Thin Buffer Layers Used in Cu/Sn Bonding for Advanced 3D Integration Applications 電子研究所 三維積體電路、接合、超薄緩衝層、銅錫接合、3DIC、Bonding、Ultra-thin buffer layer、Cu/Sn bonding | 碩士 | 104 | 2017-06-21 | 1.89 年 |
| 105 | Investigation of Asymmetry Hybrid Bonding Using Cu/Sn & Cu/Cu Bonding with Polyimide for 3D Heterogeneous Integration Applications 電子研究所 混合接合、金屬、高分子、異質整合、Hybrid bonding、Metal、Polymer、Heterogeneous integration | 碩士 | 104 | 2017-06-21 | 1.89 年 |
| 105 | Simulation Analysis and Process Development of Low Temperature Cu Direct Bonding Using Pillar-Concave Structure in Advanced 3D Heterogeneous Integration 電子研究所 模擬、低溫接合、銅接合、simulation、low temperature bonding、Cu bonding | 碩士 | 105 | 2017-06-06 | 0.85 年 |
| 105 | Key Technologies and Platform Development for 3D Integration 電子研究所 三維積體電路、矽直通穿孔、接合技術、可測性架構、3DIC、TSV、bonding technology、testing structure | 博士 | 98 | 2017-04-16 | 7.71 年 |
| 105 | Development of Low Temperature Cu Bonding and Heterogeneous Integration Platform 電子研究所 低溫接合、三維積體電路、異質整合、low temperture bonding、three dimensional integrated circuit、heterogeneous integration | 博士 | 99 | 2017-03-06 | 6.60 年 |
| 105 | Ultra-High-Resolution Neural Sensing Biosensor Development with 3D Heterogeneous Integration 電子研究所 三維積體電路、矽中介層、異質整合、3DIC、Silicon interposer、Heterogeneous integration | 博士 | 99 | 2017-02-28 | 6.58 年 |
| 105 | Adhesion Property of Polyimide and Passivation Layer with the Usage of Cobalt for Metal/Polymer Hybrid Bonding in 3D Integration 電機資訊國際學程 粘附強度研究、四點彎曲儀、混和接合、超薄緩衝層、低溫金屬接合、adhesion、4 point bending、hybrid bonding、ultra-thin buffer layer、low temperature metal bonding | 碩士 | 103 | 2017-01-16 | 2.46 年 |
| 105 | Uneven-Topography-Chip 3D Heterogeneous Integration Using Double-Self-Assembly Technology for MEMS and Biomedical Microsystem Applications 電子研究所 雙重自我組裝、非平整表面晶片、三維異質整合、Double-Self-Assembly、Uneven-Topography-Chip、3D Heterogeneous Integration | 碩士 | 103 | 2016-10-17 | 2.21 年 |
| 104 | Polymer Morphology Analysis for Temporary Bonding and Asymmetric Low Temperature Bonding Structure Using Ultra-thin Buffer Layer in 3D Integration 電子工程學系 電子研究所 三維積體電路、低溫接合、暫時性接合、3DIC、temporary bonding、low temperature bonding | 碩士 | 103 | 2016-06-26 | 1.90 年 |
| 104 | Investigation of Single Side Heated Chip-to-Wafer Bonding and Low Temperature Asymmetry Hybrid Bonding for 3D Heterogeneous Integration Applications 電子工程學系 電子研究所 三維積體電路、單邊加熱、混和接合、3DIC、Single sided heating、Hybrid bonding | 碩士 | 103 | 2016-06-22 | 1.89 年 |
| 104 | Development and Electrical Investigation of Through Glass Via and Through Si Via in 3D Integration 電子工程學系 電子研究所 玻璃穿孔、矽穿孔、三維積體電路、Through Glass Via、Through Si Via、3D Integration | 碩士 | 103 | 2016-06-20 | 1.89 年 |
| 104 | Development, Electrical Performance, and Reliability Investigations of 3-D ICs Key Technologies and Hybrid Bonding Process Platform 電子工程學系 電子研究所 三維積體電路、混和接合、矽晶直通孔、3DIC、Hybrid bonding、TSV | 博士 | 101 | 2016-06-02 | 3.84 年 |
| 103 | Study of Self-Assembly Technology for 3D Integration Applications 電子物理系所・共同指導：周苡嘉 三維積體電路、自我組裝、親疏水表面張力、晶圓對疊方式、晶圓接合、3DIC、Self-assembly、Self-assembled monolayers、SAM、Hydrophilic/Hydrophobic、3D stacking、Bonding technology | 碩士 | 102 | 2015-08-01 | 2.00 年 |
| 103 | Fabrication of Copper Pillar and Tapered Cu TSV for Direct Bonding in 3D integration 電子工程學系 電子研究所 三維積體電路、矽穿孔、銅柱、銅銅接合、銅電鍍、3D IC、TSV、Copper pillar、Cu-Cu bonding、Cu plating | 碩士 | 102 | 2015-06-30 | 1.91 年 |
| 103 | Investigation of Low Temperature Cu Pillar Thermosonic Bonding for 3D Integration Applications 電子工程學系 電子研究所 三維積體電路、覆晶封裝、超音波接合、銅柱、銅銦介金屬化合物、3D ICs、Flip-chip bonding、Thermosonic bonding、Copper pillar、Cu/In intermetallic compounds | 碩士 | 102 | 2015-06-30 | 1.91 年 |
| 103 | Development of Advanced 3D IC Technologies with Photolysis Polymer in Temporary Bonding and Ni/Sn Transient Liquid Phase Interconnect Bonding 電子工程學系 電子研究所 暫時性接合、光裂解高分子、鎳錫暫態液相接合、temporary bonding、photolysis polymer、Ni/Sn transient liquid phase bonding | 碩士 | 102 | 2015-06-23 | 1.89 年 |
| 103 | A Novel Direct Cu-to-Cu Bonded Structure and Reliability Investigation in 3-D Integration 電子工程學系 電子研究所 三維積體電路、銅與銅接合、Bonding、3-D Integration | 碩士 | 101 | 2015-06-20 | 2.88 年 |
| 103 | Development and Electrical Investigation of Fine-Pitch Cu/Sn Pad Bonding Using Ultra-Thin Buffer Layer Technique in 3D Integration 電子工程學系 電子研究所 三維積體電路、銅/錫接合、超薄緩衝層、細間距金屬內連線、3D integration、Cu/Sn bonding、Ultra-thin buffer layer、fine-pitch interconnect | 碩士 | 102 | 2015-06-15 | 1.87 年 |
| 103 | Study on Characteristics and Applications of Frequency Resonator Devices with 3D IC Integration 電子工程學系 電子研究所 三維積體電路技術、矽直銅導孔、晶圓級接合、晶圓薄化技術、石英頻率元件、3D integration、Cu through-silicon-vias、Wafer level bonding、wafer thinning techniques、quartz resonator device | 博士 | 98 | 2015-05-17 | 5.79 年 |
| 103 | Investigation of Low-Temperature Wafer Bonding and Its Applications for 3D Integration 電子工程學系 電子研究所 三維整合、低溫、晶圓接合、3D integration、Low temperature、Wafer bonding | 博士 | 98 | 2014-10-14 | 5.20 年 |
| 103 | Investigation of Interfacial Behavior of Low Temperature Cu/In Bonded Structure in 3DIC 電子工程學系 電子研究所 銅銦合金、金屬氧化物、低溫接合、copper indium solder、indium oxide、low temperature bonding | 碩士 | 101 | 2014-06-26 | 1.90 年 |
| 102 | Low Temperature Hybrid Bonding with 3D IC Heterogeneous Integration for LED Application 電子工程學系 電子研究所 三維積體電路、異質整合、低溫接合、混合接合、藍寶石基板、3D IC、Heterogeneous Integration、Low Temperature Bonding、Hybrid Bonding、Sapphire | 碩士 | 101 | 2014-08-17 | 2.04 年 |
| 102 | Process Integration and Development of Advanced 3D IC Key Technologies with Temporary Bonding and Bottom-Up TSV Formation 電子工程學系 電子研究所 三維積體電路、暫時接合、矽穿孔、Three-dimensional integrated circuit、Temporary bonding、Through silicon via | 碩士 | 101 | 2014-06-24 | 1.89 年 |
| 102 | Key Technologies of 3-D ICs for Advanced BSI-CIS Application 電子工程學系 電子研究所 三維積體電路、晶圓接合、晶圓薄化、聚亞醯胺接合、背照射互補示電晶體影像感應元件、3DIC、Wafer bonding、Wafer thinning、Polyimide bonding、BSI-CIS | 碩士 | 100 | 2013-11-18 | 2.30 年 |
| 101 | Investigation of Low Temperature Cu/In Bonding in 3D IC 電子工程學系 電子研究所 三維積體電路技術、低溫接合、3D IC、3D integration、Low temperature bonding | 碩士 | 99 | 2013-06-12 | 2.86 年 |
| 101 | Investigation of Adhesion Strength and Hetero-Bonding for 3D IC Applications 電子工程學系 電子研究所 三維積體電路、附著力、異質接合、3D IC、adhesion、hetero-bonding | 碩士 | 98 | 2013-03-19 | 3.63 年 |
| 101 | Ultra-Thin Silicon Layer Transfer with Oxide Bonding for BSI-CIS Application 電子工程學系 電子研究所 silicon oxide bonding、pre-treatment、silicon thin film transfer、氧化矽接合、前處理、矽薄膜轉移 | 碩士 | 99 | 2012-11-06 | 2.27 年 |
| 101 | Study on Cu/Ti bonding and its applications in 3D IC 電子工程學系 電子研究所 三維積體電路、共鍍金屬、接合、銅、鈦、3D-IC、Co-sputtering metal、bonding、Cu、Ti | 碩士 | 98 | 2012-09-11 | 3.11 年 |
| 101 | Research of Through Silicon Via in Three-Dimensional Integrated Circuits 電子工程學系 電子研究所 三維積體電路、矽穿孔導線、蝕刻製程、電鍍製程、博膜製程、封口焊點自下而上電鍍法、3DIC、TSV、Bosch process、ECD、Thin film process、Sealing bump bottom-up plating | 碩士 | 99 | 2012-09-04 | 2.09 年 |
| 101 | Electrical Performance and Reliability Investigation of Co-sputtered Cu/Ti as 3D Bonded Interconnect 電子工程學系 電子研究所 三維積體電路、共鍍銅鈦金屬、自動形成黏合層、3DIC、Co-sputtered Cu/Ti、Self-formed adhesion layer | 碩士 | 100 | 2012-08-30 | 1.08 年 |
| 101 | Reliability and Low Temperature Bonding (<150 °C) with Cu-In-Sn Based Interconnects for 3D Integration 電子工程學系 電子研究所 三維積體電路、低溫接合、3D IC、low temperature bonding | 碩士 | 100 | — | 無法計算 |
| 100 | Three-Dimensional Integrated Circuit Key Technology: Metal to Polymer Hybrid Bonding 電子工程學系 電子研究所 三維積體電路、矽晶直通孔、混合接合、3D-ICs、TSV、Hybrid bonding | 碩士 | 97 | 2012-07-02 | 3.92 年 |